[Information] About the bonding interface of Cu wire bonding
It provides a detailed explanation of various wire bonding methods, results, and discussions!
This document presents the bonding interface of Cu wire bonding in semiconductor packages. It provides a detailed explanation of the samples and methods, various wire bonding techniques, results, and discussions, accompanied by figures and photographs. 【Contents】 ■ Introduction ■ Samples and Methods ■ Various Wire Bonding Techniques ■ Results and Discussion ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.
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【Other Published Content (Excerpt)】 ■Results and Discussion - Observation of the bonding area - Selection of cross-section preparation method - Distribution of coated Pd - Observation of Cu grains using EBSD - Cu-Al joint interface - Observation of Al joint surface after opening etching *For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.