[Information] About the bonding interface of Cu wire bonding
It provides a detailed explanation of various wire bonding methods, results, and discussions!
This document presents the bonding interface of Cu wire bonding in semiconductor packages. It provides a detailed explanation of the samples and methods, various wire bonding techniques, results, and discussions, accompanied by figures and photographs. 【Contents】 ■ Introduction ■ Samples and Methods ■ Various Wire Bonding Techniques ■ Results and Discussion ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.
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【Other Published Content (Excerpt)】 ■Results and Discussion - Observation of the bonding area - Selection of cross-section preparation method - Distribution of coated Pd - Observation of Cu grains using EBSD - Cu-Al joint interface - Observation of Al joint surface after opening etching *For more details, please refer to the PDF document or feel free to contact us.
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