[Data] Whisker Observation
Support from reliability testing observations to 3D measurement! It is possible to conduct whisker evaluations while eliminating transportation risks.
While lead-free solder is becoming widespread, whiskers formed from Sn plating or solder joints have a significant impact on the reliability of electronic components. Our company observes whiskers using a digital microscope with depth composition capabilities and conducts three-dimensional measurements to evaluate whisker growth. By collaborating with the reliability testing group, we can implement whisker evaluations quickly and eliminate transportation risks. 【Features】 ■ Support from observation to three-dimensional measurement in reliability testing ■ Observation of whiskers using a digital microscope with depth composition capabilities ■ Ability to conduct whisker evaluations quickly and eliminate transportation risks *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Service Flow】 ■Reliability Testing (Elimination of Transport Risks) ■Occurrence Frequency Observation (Double-check to avoid oversight) ■Photography ■3D Measurement ■Reporting *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
