[Data] Whisker Analysis by EBSD
Introducing a case study analyzing whiskers that occurred on the lead terminals of an IC package!
This document introduces a case study on whiskers that occurred on the lead terminals of IC packages, where cross-sections were created through mechanical polishing, followed by SEM observation and EBSD analysis. It includes surface SEM images of the IC package as well as cross-sectional SEM images. It is evident that the crystal grains and grain boundaries measured by the EBSD method are consistent. We encourage you to read it. 【Published Cases】 ■Observation/Cross-section Preparation ■Analysis by EBSD *For more details, please refer to the PDF document or feel free to contact us.
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