Observation of thermal deformation using a 3D shape measurement device (VR-6200)

By combining the VR-6200 with the heater stage, it becomes possible to visualize changes during heating.

last updated Jun 26, 2025

Effects of heat generated during cross-section ion milling (CP) processing.

We would like to present the results of our observations on the production of cross-sections of rubber products and a comparison of cross-section production methods!

last updated Jun 26, 2025

Example of failure analysis of chip resistors

We will introduce processing and observation methods using mechanical polishing, SEM, and EDX!

last updated Aug 08, 2025

Confirmation of chiplet package structure by mechanical polishing.

Cross-sectional samples were created using X-ray CT observation and mechanical polishing, and structural confirmation was conducted!

last updated Mar 02, 2026

Ultrasonic microscope observation of printed circuit boards.

Delamination inside the circuit board, which is not visible during visual inspection, can also be visualized!

last updated Mar 18, 2026

Observation of wire bonding shapes

Introduction to wire bonding and other aspects of SOP (Small Outline Package) packages!

last updated Apr 17, 2026