Cross-section polishing (CP) method for cross-sectional observation service.
Achieve high processing precision and a wide processing area! Machining is also possible while reducing damage with cooling functions.
The CP method allows for the observation of cross-sections without damage from polishing, compared to mechanical polishing methods. Our triple ion milling device with cooling function achieves high processing precision and a wide processing area through ion beams irradiated from three directions. For materials sensitive to heat, processing can be done while reducing damage with the cooling function. 【Features】 ■ Capable of processing over a wide range with a processing width of approximately 4mm and a processing depth of about 1mm ■ High flatness in both hard and soft materials, enabling the production of cross-sections without physical damage ■ Capable of producing cross-sections with good positional accuracy ■ Processing can be done while cooling (cryogenic) *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Device Specifications】 ■ Triple Ion Milling Device with Cooling Function - Maximum Sample Size: 50×50×10mm - Maximum Processing Width: 4mm - Pinpoint Position Accuracy: 10–20μm - Cooling Function: Down to -150℃ *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.
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Information about the CP processing device Arblade5000_Wide Area Cross-section Milling
We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the cross-section milling width can be expanded up to 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the width of processing is possible ■ The previously localized observation range can be significantly expanded ■ Equipped with a cooling temperature adjustment function to control temperature rise caused by ion beam irradiation ■ The observable range is approximately 8mm
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.