MLCC crack X-ray observation
Cracks that couldn't be detected visually might be found with X-rays!
When stress such as warping, bending, or twisting is applied to the printed circuit board, cracks may occur inside the MLCC (Multi-Layer Ceramic Chip Capacitor). Additionally, cracks that occur internally are often hidden by the electrodes, making it difficult to detect them from the exterior. In such cases, how about checking with X-rays? [Observation Details] ■ Oblique CT Observation It is possible to perform CT without destroying the printed circuit board, in its original state. ■ Orthogonal CT Observation It is possible to observe the shape of the components in their original state. *For more details, please refer to the PDF document or feel free to contact us.
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