All products and services
331～360 item / All 360 items
-
Observation of substrate deformation using a 3D shape measuring machine (VR-6200)
Measure the change state with a 3D shape measuring device! Visually confirm the indented shape and amount due to pressure.
last updated
-
Component analysis of organic substances (FT-IR and GC/MS)
Introducing how to differentiate the use of FT-IR and GC/MS when conducting component analysis!
last updated
-
Rubber heat aging test
Capable of conducting various tests such as thermal aging tests and damp heat degradation tests for materials like rubber!
last updated
-
About the curing temperature of epoxy resin free from hazardous substances.
We conducted measurements to reconfirm the temperature at which heat is generated during hardening!
last updated
-
Evaluation of tensile properties using a extensometer compatible with high-stretch flexible materials.
To accurately measure strain in a tensile test, measurement using a strain gauge is necessary!
last updated
-
Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case study on the method of processing cross-sections using toy car tires!
last updated
-
Observation of thermal deformation using a 3D shape measurement device (VR-6200)
By combining the VR-6200 with the heater stage, it becomes possible to visualize changes during heating.
last updated
-
Poisson's ratio measurement
We will select the appropriate extensometer according to the measurement target, so please feel free to consult with us.
last updated
-
Announcement of the introduction of Talos F200E
Improved resolution for TEM and STEM! Performance significantly enhanced with the capability for EDS analysis using four detectors.
last updated
-
Effects of heat generated during cross-section ion milling (CP) processing.
We would like to present the results of our observations on the production of cross-sections of rubber products and a comparison of cross-section production methods!
last updated
-
X-ray CT analysis and EDX analysis of capsule powder.
It is also possible to conduct particle size distribution measurement of powders used in pharmaceuticals and compositional analysis of organic substances (GCMS and LCMS)!
last updated
-
Dynamic viscoelasticity measurement of CFRP
We present the results of DMA measurements conducted on CFRP made of plain-woven carbon fiber with an epoxy resin matrix!
last updated
-
Total solution service for power devices
We thoroughly evaluate and verify power devices from every angle.
last updated
-
Total support service for LED.
We will thoroughly evaluate and verify the LED from all angles.
last updated
-
Aites Device List
This is a list of devices used for analysis, evaluation, and testing services at AITES.
last updated
-
Total solutions for the reliability of semiconductor products.
Support for the difficulties in the development and evaluation of components, devices, and materials related to semiconductor products.
last updated
-
Total solution for the reliability of liquid crystal displays.
We provide comprehensive support for customers facing reliability issues with overseas manufactured LCD displays, from reliability testing to failure analysis and material analysis.
last updated
-
Failure analysis of power devices
We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.
last updated
-
Analysis of electronic components and materials using TEM.
TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.
last updated
-
Analysis of the assembly joints of the implemented components
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.
last updated
-
Cross-beam FIB cross-sectional observation
It is possible to observe cross-sections while observing FIB processing in real time.
last updated
-
Introduction to Reliability Assurance Services
We conduct reliability evaluation tests for various electronics products, components, and materials in accordance with standard specifications such as JIS, JEDEC, and MIL.
last updated
-
ESD/Latch-Up Test Contract Service
ESD/Latch-Up Test Contract Service
last updated
-
In-Situ Continuous Measurement Reliability Evaluation Testing Service
In-Situ Continuous Measurement Reliability Evaluation Testing Service
last updated
-
Overseas Manufactured Parts and Products Evaluation Service
Some overseas manufactured parts and products may have quality issues. We provide quality evaluation services for reliability testing and assessment for these.
last updated
-
Analysis of microscopic foreign substances using imaging FT-IR.
If it is 5 micrometers or larger, foreign object IR data can be obtained.
last updated
-
Sampling techniques for the analysis of microscopic foreign substances
We will report rapid analysis results using various sampling techniques regarding foreign substances that significantly impact the yield of electronics products.
last updated
-
Surface analysis using TOF-SIMS.
TOF-SIMS can analyze light elements and inorganic substances as well as large organic molecules.
last updated
-
Total Solution for Quality Technology
We provide quick and accurate solutions based on technology and experience for quality initiatives that consider performance, reliability, disposal, and recycling from the product planning stage.
last updated
-
Latch-up test contract service
We provide latch-up testing services to evaluate the resistance of CMOS ICs and semiconductor products containing them to latch-up destruction.
last updated