All products and services
331～352 item / All 352 items
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Announcement of the introduction of Talos F200E
Improved resolution for TEM and STEM! Performance has been significantly enhanced, allowing for EDS analysis with four detectors.
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Effects of heat generated during cross-section ion milling (CP) processing.
We would like to present the results of our observations on the production of cross-sections of rubber products and a comparison of cross-section production methods!
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X-ray CT analysis and EDX analysis of capsule powder.
It is also possible to conduct particle size distribution measurement of powders used in pharmaceuticals and compositional analysis of organic substances (GCMS and LCMS)!
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Dynamic viscoelasticity measurement of CFRP
We present the results of DMA measurements conducted on CFRP made of plain-woven carbon fiber with an epoxy resin matrix!
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Total solution service for power devices
We thoroughly evaluate and verify power devices from every angle.
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Total support service for LED.
We will thoroughly evaluate and verify the LED from all angles.
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Aites Device List
This is a list of devices used for analysis, evaluation, and testing services at AITES.
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Total solutions for the reliability of semiconductor products.
Support for the difficulties in the development and evaluation of components, devices, and materials related to semiconductor products.
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Total solution for the reliability of liquid crystal displays.
We provide comprehensive support for customers facing reliability issues with overseas manufactured LCD displays, from reliability testing to failure analysis and material analysis.
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Failure analysis of power devices
We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.
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Analysis of electronic components and materials using TEM.
TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.
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Analysis of the assembly joints of the implemented components
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.
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Cross-beam FIB cross-sectional observation
It is possible to observe cross-sections while observing FIB processing in real time.
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Introduction to Reliability Assurance Services
We conduct reliability evaluation tests for various electronics products, components, and materials in accordance with standard specifications such as JIS, JEDEC, and MIL.
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ESD/Latch-Up Test Contract Service
ESD/Latch-Up Test Contract Service
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In-Situ Continuous Measurement Reliability Evaluation Testing Service
In-Situ Continuous Measurement Reliability Evaluation Testing Service
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Overseas Manufactured Parts and Products Evaluation Service
Some overseas manufactured parts and products may have quality issues. We provide quality evaluation services for reliability testing and assessment for these.
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Analysis of microscopic foreign substances using imaging FT-IR.
If it is 5 micrometers or larger, foreign object IR data can be obtained.
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Sampling techniques for the analysis of microscopic foreign substances
We will report rapid analysis results using various sampling techniques regarding foreign substances that significantly impact the yield of electronics products.
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Surface analysis using TOF-SIMS.
TOF-SIMS can analyze light elements and inorganic substances as well as large organic molecules.
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Total Solution for Quality Technology
We provide quick and accurate solutions based on technology and experience for quality initiatives that consider performance, reliability, disposal, and recycling from the product planning stage.
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Latch-up test contract service
We provide latch-up testing services to evaluate the resistance of CMOS ICs and semiconductor products containing them to latch-up destruction.
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