All products and services
331～360 item / All 366 items
-
Evaluation of various implementation substrates
IPC-A-610 certified IPC specialists are available! Assistance with observations in accordance with international standards.
last updated
-
Strain measurement of power module package resin.
Measuring the strain behavior of the sealing resin under thermal cycling using a strain gauge!
last updated
-
Observation of CMOS image sensor cross-section by mechanical polishing.
Due to the advantages and disadvantages, it is necessary to choose according to the sample form, observation range, purpose, etc.!
last updated
-
Appearance observation and measurement services
We are equipped with a variety of devices to meet your needs, including dimension measurement of various parts and surface roughness measurement!
last updated
-
NMR analysis of liquid crystal compounds
Introducing the information obtained from NMR, using 1H NMR, 13C NMR, and DEPT measurements as examples!
last updated
-
Observation of tracking camera cross-section by mechanical polishing.
Observation of the sensor chip surface, creating a cross-section through mechanical polishing in the mounted state, and conducting structural observation of the device!
last updated
-
Observation of substrate deformation using a 3D shape measuring machine (VR-6200)
Measure the change state with a 3D shape measuring device! Visually confirm the indented shape and amount due to pressure.
last updated
-
Component analysis of organic substances (FT-IR and GC/MS)
Introducing how to differentiate the use of FT-IR and GC/MS when conducting component analysis!
last updated
-
Rubber heat aging test
Capable of conducting various tests such as thermal aging tests and damp heat degradation tests for materials like rubber!
last updated
-
About the curing temperature of epoxy resin free from hazardous substances.
We conducted measurements to reconfirm the temperature at which heat is generated during hardening!
last updated
-
Evaluation of tensile properties using a extensometer compatible with high-stretch flexible materials.
To accurately measure strain in a tensile test, measurement using a strain gauge is necessary!
last updated
-
Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case study on the method of processing cross-sections using toy car tires!
last updated
-
Observation of thermal deformation using a 3D shape measurement device (VR-6200)
By combining the VR-6200 with the heater stage, it becomes possible to visualize changes during heating.
last updated
-
Poisson's ratio measurement
We will select the appropriate extensometer according to the measurement target, so please feel free to consult with us.
last updated
-
Announcement of the introduction of Talos F200E
Improved resolution for TEM and STEM! Performance significantly enhanced with the capability for EDS analysis using four detectors.
last updated
-
Effects of heat generated during cross-section ion milling (CP) processing.
We would like to present the results of our observations on the production of cross-sections of rubber products and a comparison of cross-section production methods!
last updated
-
X-ray CT analysis and EDX analysis of capsule powder.
It is also possible to conduct particle size distribution measurement of powders used in pharmaceuticals and compositional analysis of organic substances (GCMS and LCMS)!
last updated
-
Dynamic viscoelasticity measurement of CFRP
We present the results of DMA measurements conducted on CFRP made of plain-woven carbon fiber with an epoxy resin matrix!
last updated
-
Total solution service for power devices
We thoroughly evaluate and verify power devices from every angle.
last updated
-
Total support service for LED.
We will thoroughly evaluate and verify the LED from all angles.
last updated
-
Aites Device List
This is a list of devices used for analysis, evaluation, and testing services at AITES.
last updated
-
Total solutions for the reliability of semiconductor products.
Support for the difficulties in the development and evaluation of components, devices, and materials related to semiconductor products.
last updated
-
Total solution for the reliability of liquid crystal displays.
We provide comprehensive support for customers facing reliability issues with overseas manufactured LCD displays, from reliability testing to failure analysis and material analysis.
last updated
-
Failure analysis of power devices
We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.
last updated
-
Analysis of electronic components and materials using TEM.
TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.
last updated
-
Analysis of the assembly joints of the implemented components
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.
last updated
-
Cross-beam FIB cross-sectional observation
It is possible to observe cross-sections while observing FIB processing in real time.
last updated
-
Introduction to Reliability Assurance Services
We conduct reliability evaluation tests for various electronics products, components, and materials in accordance with standard specifications such as JIS, JEDEC, and MIL.
last updated
-
ESD/Latch-Up Test Contract Service
ESD/Latch-Up Test Contract Service
last updated
-
In-Situ Continuous Measurement Reliability Evaluation Testing Service
In-Situ Continuous Measurement Reliability Evaluation Testing Service
last updated