アイテス Official site

State analysis using EPMA

Estimate bonding states by comparing with standard spectra! Introducing state analysis using EPMA.

In the state analysis using EPMA, changes (shifts and shapes) in the characteristic X-ray peak wavelengths due to differences in the chemical bonding states (ionic valence, crystal structure, coordination number) of oxides and silicates are utilized to estimate the bonding states by comparing with standard spectra. In the identification of two types of copper oxides, when distinguishing between black CuO and red Cu2O by color is difficult, especially for microscopic objects that require an electron microscope, it is possible to grasp the oxidation state using EPMA. Additionally, while XPS is effective for measuring thin oxide layers on aluminum surfaces, EPMA can be used to understand the oxidation state of small foreign particles, bulk materials, and composites. 【Device Specifications】 ■ Manufacturer: JEOL Ltd. Jeol-8200 ■ Analysis Method: Wavelength Dispersive X-ray Analysis (WDX) ■ Analyzable Elements: B to U ■ Energy Resolution: 20 eV (EDX is approximately 130 eV) ■ Detection Limit: 0.01% and above ■ Maximum Sample Size: 100x100 mm *For more details, please refer to the PDF document or feel free to contact us.

Related Link - https://www.ites.co.jp/section/index.html

basic information

For more details, please refer to the PDF document or feel free to contact us.

Price range

Delivery Time

Applications/Examples of results

For more details, please refer to the PDF document or feel free to contact us.

catalog(21)

Download All Catalogs

State analysis by EPMA

TECHNICAL

[Analysis Example by EBSD] Chip

PRODUCT

[Example of analysis using EBSD] Screw

PRODUCT

[Example of analysis using EBSD] Pipe

PRODUCT

[Example of analysis using EBSD] Via

PRODUCT

[Example of Analysis by EBSD] High Melting Point Solder

PRODUCT

Example of analysis using EBSD: steel plate

PRODUCT

Crystal analysis by EBSD BGA

PRODUCT

Crystal analysis by EBSD: Intermetallic compounds in solder joints

PRODUCT

Crystal analysis of Cu using the EBSD method.

PRODUCT

Example of analysis using the EBSD method

PRODUCT

EBSD analysis of flexible printed circuits (FPC)

PRODUCT

Example of analysis using EBSD (ceramics)

OTHER

[Data] Whisker Analysis by EBSD

OTHER

Example of analysis using EBSD: crab claw

TECHNICAL

Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

OTHER

Seven spectral crystals in EPMA analysis

TECHNICAL

[Data] Example of EPMA Analysis

OTHER

[Data] EPMA Analysis Example 2

OTHER

Example of EPMA analysis using the guide network map method.

PRODUCT

Distributors

Recommended products