All products and services
61～90 item / All 354 items
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Cutting process using a wire saw
Cross-section preservation is possible! By dividing the sample with precision cuts using a wire saw, individual cross-sections can be produced.
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Cross-sectional observation pre-treatment (sample cutting and resin embedding)
We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!
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Attention those struggling with material properties in the manufacturing process at the Institute of Chemical Reaction Mechanisms!
What is the reason for this discoloration on the surface? Why are there cracks in such places? These issues will be resolved from the perspectives of electrons, atoms, molecules, and chemical reaction mechanisms!
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Depth profiling analysis of thin film layers using XPS angle-resolved method.
Non-destructive depth analysis of thin films on the nm order is possible! We will also introduce analysis examples.
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Observation of time-dependent changes associated with reliability testing.
Applicable to change observation, with support for additional analysis! We evaluate the subject in a time series and non-destructive manner.
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[Example of analysis using EBSD] Chip
I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.
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[Example of Analysis by EBSD] Screw
We will introduce an example of analysis using EBSD for screws (Cu2Zn).
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[Example of analysis using EBSD] Pipe
I will introduce an example of analysis using EBSD for pipes (austenitic).
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Example of analysis using EBSD: Via
The EBSD method allows for the estimation of crystal size distribution and residual stress.
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[Example of analysis using EBSD] High melting point solder
Observing crystal structures with EBSD! Data can be obtained for each metal.
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Example of analysis using EBSD: Steel plate
Visualize the features that appear in the graph! You can check the distribution of crystal sizes and the orientation of crystal directions.
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Crystal analysis by EBSD BGA
The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.
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Crystal analysis by EBSD: Intermetallic compounds in solder joints
We will introduce an example of crystal analysis of intermetallic compounds at solder joints.
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EBSD analysis
Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.
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Crystal analysis of Cu using the EBSD method.
Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.
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Example of analysis using the EBSD method
We will introduce an example of the analysis of EBSD patterns (Kikuchi patterns) at gold wire bond joints.
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Cross-section polishing (CP) method for cross-sectional observation service.
Achieve high processing precision and a wide processing area! Machining is also possible while reducing damage with cooling functions.
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[Contract Analysis] Laser Microscope (High-Precision 3D Measurement & Color Observation)
It is possible to perform 3D measurements of the surface roughness of samples and surface shape measurements through transparent objects!
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Contract Analysis: Laser Microscope (Observation & Measurement)
Observation and measurement over a wide range are also possible! Here is an introduction to contract analysis using a laser microscope.
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Cross-sectional polishing service for implementation parts and electronic components.
Each part is carefully polished by hand, using an efficient process without waste!
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Surface mount electronic component cross-sectional observation service
You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!
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IC failure analysis
By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.
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OBIRCH analysis of SiC devices using short-wavelength lasers.
Since semiconductors have different physical properties, new methods are required for failure analysis!
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Failure analysis of an orange LED damaged by electrostatic discharge.
We will introduce a comparison of brightness and characteristics between good products and ESD-damaged products, along with examples of luminescence analysis using EMS microscopy!
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Backside light emission analysis of SiC devices
Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!
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Observation of the diffusion layer of SiC MOSFET using LV-SEM and EBIC methods.
Even with SiC power devices, we can provide consistent support for cross-section preparation of specific areas, observation of diffusion layer shapes, as well as wiring structure and crystal structure analysis!
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Analysis of good LCD panels
Check the quality status of LCD components and products! We will analyze the structures of the LCD panels using our analytical methods and expertise!
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Observation of diffusion layers in semiconductors using FIB-SEM.
Shorter delivery time than his method! Both shape observation using FIB-SEM and diffusion layer observation can be performed!
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Evaluation of membrane quality using EELS analysis method
EELS analysis for element identification allows for the comparison of the bonding states of materials!
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Narrowing down defective areas using the EBAC (Absorption Current) method.
"SEM images" and "absorption current images (current sensing)" etc.! It identifies open defects in wiring and areas with high resistance defects.
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