All products and services
61～90 item / All 360 items
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[Case Study] X-ray Fluoroscopy and CT Examination Equipment
Numerous examples of "BGA solder crack analysis," "surface mount LEDs," and "chip resistor observation" using X-ray fluoroscopy and angled CT observation are included!
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DMA (Dynamic Mechanical Analysis)
We offer a variety of measurement modes, including double cantilever beam bending and three-point bending with free support!
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DSC (Differential Scanning Calorimetry)
Observe the degree of endothermic/exothermic reaction of the sample! The temperature range is possible from -90°C to 550°C.
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TG-DTA (Thermogravimetric Differential Thermal Analysis)
Output the temperature difference between the sample and the reference material as a DTA signal! Change the temperature according to a constant program.
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TMA (Thermomechanical Analysis)
Information on thermal expansion, thermal contraction, and glass transition temperature can be obtained in multiple measurement modes!
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TOF-SIMS analysis of organic matter
As an example of organic matter analysis, I would like to introduce a case where polyethylene glycol was analyzed.
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TOF-SIMS analysis of trace contaminants
The analysis sensitivity of TOF-SIMS is high at the ppm level, making it effective for analyzing trace contamination!
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AFM (Atomic Force Microscope)
High-resolution imaging with a micro probe! Achieving nano-level structural analysis.
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Analysis of crystallinity in resin materials using micro-Raman spectroscopy.
By using micro-Raman, it is possible to evaluate the crystallinity in a fine range (1μm and above)!
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GCMS analysis of liquid crystal components
Comparison of components in liquid crystal panels using gas chromatography-mass spectrometry (GC-MS) is published!
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Replacement of CRTs with LCDs for factory equipment
Business trip support available: We will replace your CRT monitor with an LCD display!
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Analysis of multilayer materials using micro-Raman.
Depth-direction measurements using Raman spectroscopy! Material analysis of each layer is possible from the surface of multilayer films.
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Slice processing using isomet.
We will introduce a slicing process that allows you to keep the created cross-section as it is!
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Cutting process using a wire saw
Cross-section preservation is possible! By dividing the sample with precision cuts using a wire saw, individual cross-sections can be produced.
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Cross-sectional observation pre-treatment (sample cutting and resin embedding)
We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!
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Attention those struggling with material properties in the manufacturing process at the Institute of Chemical Reaction Mechanisms!
What is the reason for this discoloration on the surface? Why are there cracks in such places? These issues will be resolved from the perspectives of electrons, atoms, molecules, and chemical reaction mechanisms!
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Depth profiling analysis of thin film layers using XPS angle-resolved method.
Non-destructive depth analysis of thin films on the nm order is possible! We will also introduce analysis examples.
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Observation of time-dependent changes associated with reliability testing.
Applicable to change observation, with support for additional analysis! We evaluate the subject in a time series and non-destructive manner.
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[Example of analysis using EBSD] Chip
I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.
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[Example of Analysis by EBSD] Screw
We will introduce an example of analysis using EBSD for screws (Cu2Zn).
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[Example of analysis using EBSD] Pipe
I will introduce an example of analysis using EBSD for pipes (austenitic).
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Example of analysis using EBSD: Via
The EBSD method allows for the estimation of crystal size distribution and residual stress.
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[Example of analysis using EBSD] High melting point solder
Observing crystal structures with EBSD! Data can be obtained for each metal.
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Example of analysis using EBSD: Steel plate
Visualize the features that appear in the graph! You can check the distribution of crystal sizes and the orientation of crystal directions.
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Crystal analysis by EBSD BGA
The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.
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Crystal analysis by EBSD: Intermetallic compounds in solder joints
We will introduce an example of crystal analysis of intermetallic compounds at solder joints.
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EBSD analysis
Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.
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Crystal analysis of Cu using the EBSD method.
Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.
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Example of analysis using the EBSD method
We will introduce an example of the analysis of EBSD patterns (Kikuchi patterns) at gold wire bond joints.
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Cross-section polishing (CP) method for cross-sectional observation service.
Achieve high processing precision and a wide processing area! Machining is also possible while reducing damage with cooling functions.
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