IC failure analysis
By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.
We would like to introduce Aites Inc.'s "Defect Analysis of ICs." Our company provides a comprehensive approach to ICs by combining methods suitable for various defect modes, from identifying defective nodes to physical analysis. We offer various analysis techniques, including "Light Emission Analysis/OBIRCH Analysis," which allows layout verification using a Layout Viewer, as well as "Layer Delamination/Sample Processing," "PVC Analysis," "Diffusion Layer Etching," and "sMIM Analysis." 【Methods】 ■ Light Emission Analysis/OBIRCH Analysis ■ Layer Delamination/Sample Processing ■ Microprobe ■ PVC Analysis ■ EBAC Analysis ■ Physical Analysis (FIB-SEM, TEM) *For more details, please refer to the PDF document or feel free to contact us.
basic information
[Features of Emission Analysis/OBIRCH Analysis] ■ Identification of leak points or related networks through emission/OBIRCH analysis ■ Layout confirmation is possible using the Layout Viewer ■ Customized equipment allows for analysis of various samples *For more details, please refer to the PDF document or feel free to contact us.*
Price range
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
