All products and services
1～17 item / All 17 items
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3D Localized Heating Device "S-WAVE301"
Achieving high continuous operation performance! Increased cooling power extends heating time during high output.
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3D Local Heating Device 'S-WAVE301A'
Rapidly heating a narrow spot to 300℃! Compliant with various regulations such as ICNRP and the Radio Law.
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IH soldering device "S-WAVE FBA series"
Equipped with loader/unloader! Targeting inline processes after soldering and multi-product production, etc.
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3D local heating device 'S-WAVE' compatible with characteristic bases.
Three evolving lineups that meet the needs of the times! Introducing the 3D local heating device.
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A 3D local heating IH soldering device that can also accommodate characteristic substrates!
Capable of outputting a large amount of heat, it can handle a wide range of substrates with just "one unit"! Compliant with various regulations such as ICNIRP and the Radio Law, 'S-WAVE301H'.
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【IH Soldering Example】Wall Terminal
Introducing a case where soldering was made possible even with a distance of 4mm between the resin case and the terminal!
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[IH Soldering Case] Large Heat Capacity Substrate
A field where the IH method excels! Introducing a case study that achieved soldering on a 6-layer thick copper substrate.
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Overcoming the challenges of soldering: "IH Soldering Device" [Case Study]
Since it heats metal non-contact, soldering is possible even with a "4mm" wall terminal! We will also introduce examples of achieving soldering on a 6-layer thick copper substrate.
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[Technical Information + Case Studies] IH Automatic Soldering Equipment that Meets High-Quality Demands
Achieving improved OEE and reduced CT in the soldering process. Minimizing upstream and downstream processes while maximizing automatic soldering time with the IH soldering device 'S-WAVE'.
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IH Soldering Device S-WAVE [Improving Solder Quality and Increasing Production Volume]
"Non-contact soldering" meets high quality demands and mass production. A soldering device with non-contact and localized heating, currently under patent application. *Free sample processing available.
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IH soldering equipment utilizing non-contact heating technology.
Automating the hand soldering process! This device enables soldering that reduces cycle time and environmental impact, and achieves precise soldering!
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The IH soldering device "S-WAVE" achieves zero waste solder.
Zero waste solder + CO2 reduction for environmental measures!
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New Technology | IH Soldering Equipment Achieves Soldering through Non-Contact and Induction Heating
Non-contact and localized heating suppresses temperature rise in surrounding components. Parts that are difficult to heat and parts that are sensitive to heat can be joined with a single unit.
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IH soldering device S-WAVE demonstration
Please be sure to check the IH soldering device with your own eyes. You can confirm the actual machine at our company.
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Toyama Gihan Co., Ltd. Company Profile
Leave the design and manufacturing of labor-saving machines to us, with our unique multi-faceted skills!
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Product Packaging Machine Universal Packer
Easy operation allows for size changes to accommodate the diverse varieties requested by customers.
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Packaging Machine Universal Packer
An automatic packing system that adopts a case with an adjuster function.
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