Technical Document "Underfill BGA Rework Technology"
Can also cooperate in criminal investigations!
We can collaborate using underfill BGA rework technology. We can handle everything from the removal of underfill and coated components (such as BGA and CSP) to reballing, replacement, and reinstallation. The cured underfill material seals the BGA, significantly improving its strength compared to standard BGAs, and while its effectiveness is tremendous, the rework tasks such as removal or component replacement are more challenging than typical rework processes. At K-All, we have worked on methods and technical research to ensure that rework can be performed even on devices with various underfill materials applied. We can handle everything from component removal to reballing and replacement reinstallation. Rework and reballing are also possible for BGAs and CSPs that have undergone underfill and coating treatment. We can replace solder balls on BGAs and CSPs from lead-free to eutectic. We maintain over 5,000 types of masks for rework. ● For more details, please download the catalog or contact us.
basic information
【Features】 ○ Supports everything from component removal to reballing and replacement reinstallation. ○ Rework and reballing are possible for BGA and CSP with underfill and coating treatment. ○ Solder balls of BGA and CSP can be replaced from lead-free to eutectic. ○ More than 5,000 types of partial masks for rework are available. ● For more details, please download the catalog or contact us.
Price information
For more details, please contact us.
Delivery Time
Applications/Examples of results
■Published in the Nikkan Kogyo Shimbun The underfill rework process at K-All has been featured in the Nikkan Kogyo Shimbun. Mobile phones that have been intentionally damaged (burned, thrown into rivers or seas, run over by cars, etc.) are deemed irreparable by manufacturers. In processes that apply the underfill rework technique, we can assist with memory rework tasks that lead to data recovery.
