BGA rework and reballing services
BGA rework and reballing services
Overview of BGA Rework and Reballing Services Approximately 3,000 rework cases per year Are you giving up on that circuit board? At K-All, we utilize technologies such as replacement, re-implementation, reballing, reflow, underfill filling, BGA jumpers, and POP implementation for BGA, LGA, QFN, and more to solve various issues related to circuit boards and devices. With over 20 years of extensive know-how and achievements, we currently handle approximately 3,000 rework cases annually through our dedicated rework department.
1～16 item / All 16 items
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Semiconductor reuse
If you are having trouble with the delivery times of semiconductor ICs, please contact K-All.
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[Exchange/Installation/Removal] High-quality BGA rework
BGA exchange, installation, and removal services available! We have received voices of joy.
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BGA rework with underfill
Advanced rework technology! It prevents the concentration of stress that occurs on the connection surface of solder balls.
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BGA Reballing [Presentation of technical materials for BGA reballing and rework]
We have numerous achievements in reballing and reworking "BGA with underfill," which is highly challenging in BGA reballing and rework! Technical materials featuring case studies are currently available!
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Underfill BGA Rework Technology *Technical materials available!
【Technical Data Presentation】Achieving 3,000 cases annually! Capable of supporting both eutectic and lead-free! Packed with technical information such as BGA reballing that regenerates solder balls!
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Warping of the circuit board that occurs during BGA rework.
Especially for substrates that warp significantly, warping suppression is essential! Reproduce the condition of the BGA when warping occurs!
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BGA Rework and Reballing Support [Case Study Introduction]
Support for BGA rework and reballing that cannot afford to fail.
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Technical Document "Underfill BGA Rework Technology"
Can also cooperate in criminal investigations!
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Change in the composition of BGA solder from lead-free to eutectic solder [Case Study]
I want to change the composition from lead-free solder balls to eutectic solder balls! We will solve your concerns about solder composition changes!
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LGA implementation and rework
We propose proper implementation regarding LGA! We also accept rework tasks in case of defects.
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POP implementation and rework
Proposal based on the concept of new POP implementation! It can reduce the package footprint after implementation.
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POP Implementation and Rework [Case Study Introduction]
Supports upper and lower exchanges! POP implementation and rework are possible.
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BGA jumper wiring
Solve problems with abundant experience and reliable skills! BGA jumpers possible down to 0.4mm pitch.
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Circuit board repair (jumper, pattern cut, PAD repair, etc.)
Solve problems with abundant experience and reliable technical skills! Various circuit board repairs and modifications, including pattern cutting, are possible.
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X-ray examination
Achieving non-destructive testing for BGA and CSP! As part of our pursuit of high quality, we have established detailed inspection standards.
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Defective examples in X-ray inspection
Using a sample board, we will implement the BGA! I will explain each defect!
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