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BGA Rework and Reballing Support [Case Study Introduction]

Support for BGA rework and reballing that cannot afford to fail.

At Kei All, we accept BGA rework even for boards that are not implemented in our own line. If it is at an early stage of the process, rework may be easily performed. We often receive requests for difficult BGA rework and reballing from other assembly companies in the industry. We support "BGA rework and reballing work that cannot afford to fail," especially for high-cost and hard-to-obtain devices. [Features] - Support for device rework - BGA rework compatible For more details, please contact us or download the catalog.

Related Link - http://kei-all.co.jp/rescue/bga_oem

basic information

【Case Study】 [Requesting rework of BGA that failed at another company] We received a request for rework of a BGA that failed at another company and completed the work without any issues. * Based on our technology and equipment capabilities, we often receive various requests from other companies in the same industry. * We also handle BGA rework, reballing, underfill rework, high-difficulty modifications, LGA implementation and rework, PoP rework, and more. * There are many requests for rework only from other companies in the same industry or their end-users. 【Supporting companies with such concerns】 ○ Have an assembly line but lack rework equipment ○ Requested rework from another company but were turned down ○ Implemented BGA but cannot verify due to lack of X-ray inspection equipment ● For more details, please contact us or download the catalog.

Price information

Please contact us.

Delivery Time

Applications/Examples of results

For more details, please contact us or download the catalog.

Technical Document "Underfill BGA Rework Technology"

TECHNICAL

Excerpt of Prototype Parts Implementation Know-How

TECHNICAL

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