Technical achievements
Technical achievements
Small, dense, and high multi-layered. We solve any potential troubles with our technical expertise. Please consult us before giving up!
1～20 item / All 20 items
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0402・0201 Chip Replacement・Correction【Case Study Introduction】
Manually correcting the misalignment of the Manhattan and chips! Even tiny chips can be implemented!
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Special substrate mounting service
Leave the difficult substrate assembly, such as high multilayer and high current boards, flexible boards, and aluminum boards, to us.
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Special Modification [Case Introduction]
We will save your important circuit board with a highly specialized and difficult modification.
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Special substrate mounting service [Case introduction]
Supports high multi-layer and large current substrates! Leave the challenging substrate mounting to us.
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Circuit board repair (jumper, pattern cut, PAD repair, etc.)
Solve problems with abundant experience and reliable technical skills! Various circuit board repairs and modifications, including pattern cutting, are possible.
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Down payment implementation
Several workers with over 10 years of experience, including one J-STD specialist, are on staff!
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Hand placement implementation
A team of professionals in substrate assembly! Leave it to us for lead-free, eutectic, various types, small quantities, short delivery times, and express services.
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Mount implementation
Implementation in any payout state! We can respond quickly even from a single circuit board.
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Special modification
Over 25 years of know-how! We have many skilled workers on staff and can handle even difficult special modifications.
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High difficulty implementation and rework.
Supports high-density and ultra-miniaturized components such as fine pitch 0.3mm devices!
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High-Difficulty Implementation and Rework [Case Study Introduction]
Supports high-density, ultra-miniaturized components! Capable of handling high-difficulty assembly and rework.
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POP implementation and rework
Proposal based on the concept of new POP implementation! It can reduce the package footprint after implementation.
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POP Implementation and Rework [Case Study Introduction]
Supports upper and lower exchanges! POP implementation and rework are possible.
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BGA Reballing [Presentation of technical materials for BGA reballing and rework]
We have numerous achievements in reballing and reworking "BGA with underfill," which is highly challenging in BGA reballing and rework! Technical materials featuring case studies are currently available!
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Underfill BGA Rework Technology *Technical materials available!
【Technical Data Presentation】Achieving 3,000 cases annually! Capable of supporting both eutectic and lead-free! Packed with technical information such as BGA reballing that regenerates solder balls!
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BGA Rework and Reballing Support [Case Study Introduction]
Support for BGA rework and reballing that cannot afford to fail.
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Change in the composition of BGA solder from lead-free to eutectic solder [Case Study]
I want to change the composition from lead-free solder balls to eutectic solder balls! We will solve your concerns about solder composition changes!
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EMS Service [Case Study]
EMS support available! We provide one-stop service from design to parts procurement, implementation, and assembly.
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Custom jig design
We will create a jig board tailored to your needs!
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Express service
We will work together to achieve your desired delivery date for customer satisfaction!
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