High-Difficulty Implementation and Rework [Case Study Introduction]
Supports high-density, ultra-miniaturized components! Capable of handling high-difficulty assembly and rework.
At Kei All, we are capable of handling high-difficulty implementations and reworks. Recently, there has been a significant increase in components such as leads and thermal pads. These types of components can be very difficult to rework due to their shape and the configuration of the circuit board, as they tend to be less susceptible to heat. Rework technology is one of Kei All's proud strengths. We are continuously honing our skills to address high-difficulty components, which have been increasing in number due to the miniaturization and high density of parts. 【Features】 ○ Support for high-density, ultra-miniature components such as small camera modules and fine-pitch 0.3mm devices ○ Capability for high-difficulty implementations and reworks ○ Continuous technical training and skill development For more details, please contact us or download the catalog.
basic information
[Case Study] [All prototype boards with shielded terminal SMT parts CN and LGA mounting are not functioning, and we want to replace CN and reuse LGA.] ○ Since the shielded terminal SMT part CN cannot be reused, it will be replaced with a new one, and the LGA will be reworked and reused. * The reuse of shielded terminal SMT part CN is currently a challenge that the technical team is working on. * The LGA has a high failure rate due to factors such as humidity, and as a countermeasure, we frequently use MacDry and baking, as outlined in the QC process chart. ● For more details, please contact us or download the catalog.
Price information
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Applications/Examples of results
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