Prototyping/Quick response from one piece to ultra-multilayer boards. Manual board assembly.
A professional team for substrate assembly! Leave it to us for lead-free, eutectic, various types, small quantities, short delivery times, and express services.
We perform accurate "manual placement" using K-OR's unique drawings. We can also implement components ranging from 0402 chips to QFPs, connectors, and BGAs. We have numerous achievements in aerospace and defense. Depending on the soldering conditions, we identify not only the workbench but also tools, and carry out work in an organized environment. 【Features】 ■ Support from a single piece ■ Manual placement is possible with a dispenser even without a metal mask ■ Using rework equipment, manual placement of various components including BGA is possible ■ Implementation is possible even without mounting data ■ Suitable for loose components ■ Manual placement is also possible for flexible substrates *For more details, please refer to the PDF document or feel free to contact us.
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Efforts to Create Quality Products ■ Based on soldering conditions, we implement work in a well-organized environment, identifying and arranging not only the workbench but also tools. ■ By creating unique drawings, we incorporate an efficient and safe system that allows all stakeholders to grasp the implementation details at a glance. ■ A single inspection of the implementation is conducted at each stage. ■ Solder inspection within the process is carried out before handing over to the next stage. ■ Devices and circuit boards that are sensitive to moisture are managed with MacDry before implementation. ■ Work is conducted under stable reflow conditions using nitrogen generated by a nitrogen generation device. *For more details, please refer to the PDF document or feel free to contact us.*
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【Proven Track Record】 ■ Expertise in creating reflow temperature profiles suitable for various substrates ■ Capable of mounting BGA and QFN components ■ High-difficulty assembly for aerospace and defense-related applications *For more details, please refer to the PDF document or feel free to contact us.
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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.