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Mount implementation

Implementation in any payout state! We can respond quickly even from a single circuit board.

The features of K-All's "Mounter Implementation" are its ability to specialize in prototype production. In the case of prototype implementation, there may be instances where parts are inevitably supplied as cut or loose components. Our company can handle work with a mounter starting from just one piece, even with cut or loose supplies. 【Features】 ■ Capable of handling from one piece to medium lot and mass production ■ Efficient implementation suitable for various conditions ■ Capable of accommodating various types such as new package types, flexible substrates, and multilayer boards ■ Suitable mounter support ■ Difficult-to-obtain parts can be added later ■ Free provision of CR stock during prototyping *For more details, please refer to the PDF document or feel free to contact us.

Related Link - https://www.kei-all.co.jp/mounting/smt/

basic information

Efforts to Create Quality Products ■ Establishing a system that allows for a clear understanding of implementation details by creating unique drawings ■ Managing moisture-sensitive devices and circuit boards at MacDry (1% humidity) before implementation ■ Performing reflow under stable N2 atmosphere conditions using a nitrogen generation device ■ Conducting inspection of at least one implemented unit at each stage ■ For components such as BGA and QFN, where soldering conditions cannot be visually inspected, conducting X-ray inspection for all units and performing solder inspection within the process before handing over to the next stage *For more details, please refer to the PDF document or feel free to contact us.*

Price range

Delivery Time

Applications/Examples of results

[Proven Track Record] ■ Mounting at temperatures suitable for various substrates using know-how in creating reflow temperature profiles ■ High-difficulty implementations related to aerospace and defense *For more details, please refer to the PDF document or feel free to contact us.

Technical Document "Underfill BGA Rework Technology"

TECHNICAL

Excerpt of Prototype Parts Implementation Know-How

TECHNICAL

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