Underfill BGA Rework Technology *Technical materials available!

【Technical Data Presentation】Achieving 3,000 cases annually! Capable of supporting both eutectic and lead-free! Packed with technical information such as BGA reballing that regenerates solder balls!

At K-All, we have accumulated various work methods and technical research, enabling rework operations even on devices coated with various underfill materials! Using techniques such as replacement, re-implementation, re-balling, re-heating, underfill filling, BGA jumpers, and POP implementation for BGA, LGA, QFN, etc., we solve various issues related to circuit boards and devices. In this document, we present technical materials regarding BGA rework technology. Hardened underfill materials seal the BGA, significantly improving strength and effectiveness; however, rework tasks such as removal and component replacement become more challenging than standard rework processes. Our company has been working diligently to ensure that rework operations can be performed even on devices coated with various underfill materials. [Features of Underfill] - Uses a one-component heat-curing epoxy resin - Can reduce external stress - Prevents stress concentration on the connection surface of solder balls - Widely used in mobile devices, including mobile phones *For more details, please contact us or download the catalog!

basic information

**What is Underfill?** BGA is mounted on the printed circuit board using solder balls. Due to weak connection strength, there may be cases where the reliability of the connection cannot be maintained due to the detachment of the BGA or the occurrence of cracks at the solder joints under external stresses such as impact or bending. To address these issues and improve connection reliability, a sealing resin called underfill is used in the gap between the component and the board. Typically, a one-component heat-curing epoxy resin is used as the underfill material for BGA encapsulation. This resin is applied in liquid form, penetrates the gap between the component and the board due to capillary action, and cures upon heating. By applying the underfill material, external stresses can be reduced, and it helps prevent stress concentration at the connection surface of the solder balls. Underfill materials are widely used in mobile devices, including mobile phones and music players. For more details, please contact us or download the catalog.