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LGA implementation and rework

We propose proper implementation regarding LGA! We also accept rework tasks in case of defects.

At Kei All, we can utilize our achievements and experience with LGA just like we do with BGA, allowing us to perform removal, installation, replacement, and modification. However, BGA and LGA are similar yet distinct, and it is precisely because we understand the characteristics of LGA that we can carry out rework tasks. If you are experiencing issues such as "frequent shorts in LGA assembly" or "wanting to reball LGA to convert it to BGA," please feel free to consult with us. If you have any problems with LGA, we will resolve them using our past achievements and know-how. 【Features】 ■ Addressing various issues with reliable technology ■ Rework capability allows for recovery in case of emergencies ■ Comprehensive inspection, starting with the first board, followed by the assembly and rework of the remaining boards *For more details, please refer to the PDF document or feel free to contact us.

Related Link - https://www.kei-all.co.jp/bga/lga/

basic information

[Countermeasures] ■ Control the appropriate amount of solder ■ Measures during baking ■ Converting LGA to BGA (ball mounting) *For more details, please refer to the PDF document or feel free to contact us.*

Price range

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Applications/Examples of results

[Recommended for those with such concerns and anxieties] ■ High difficulty components - Frequent shorts occurring with LGA mounting - Frequent voids with LGA mounting, resulting in unsatisfactory performance - Reworked LGA but the condition has not improved at all - Want to reball LGA and convert it to BGA *For more details, please refer to the PDF document or feel free to contact us.*

Technical Document "Underfill BGA Rework Technology"

TECHNICAL

Excerpt of Prototype Parts Implementation Know-How

TECHNICAL

Recommended products

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