Warping of the circuit board that occurs during BGA rework.
Especially for substrates that warp significantly, warping suppression is essential! Reproduce the condition of the BGA when warping occurs!
When we talk about "high-difficulty BGA rework," what kind of content do you imagine? Underfill, high-layer-count PCBs, jumpers from all BGA pins, and so on—these are things that are visually recognizable as "difficult." However, there are also aspects that are not easily understood just by appearance. One of these is "BGA rework on PCBs that are prone to warping (distortion)." Our company employs various methods to suppress warping, but there are some PCBs that are not easily managed, leading to ongoing struggles. This time, we have recreated the condition of a BGA when warping occurs. You can view the detailed content through the related links, so please take a look. *For more details, please refer to the PDF materials or feel free to contact us.
basic information
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