If you are having trouble procuring semiconductor ICs, we support the reuse of existing semiconductor substrates.
Safely recover and regenerate semiconductor ICs from existing substrates. Solve component supply and cost issues with high-precision rework technology! If you're struggling with delivery times, contact K-All.
● In an Era of Difficulty in Procuring Semiconductor Devices In recent years, it has become widely known that components, particularly semiconductor devices and connectors, are difficult to procure due to issues such as material shortages. There have been reports indicating that procurement can take several years, and we have heard the lamentations from our customers. At K-All, we safely remove hard-to-obtain electronic components from existing circuit boards using advanced rework technology, enabling their reuse. From trial runs of a single unit to mass production of up to 100,000 units, we promptly resolve issues related to circuit board modifications and component procurement with our skilled techniques and state-of-the-art equipment. *For more details, please contact us or download our catalog!*
basic information
●Reusability of BGA, LGA, and QFN is possible. BGA devices can be re-balled after removal (both eutectic and lead-free are acceptable). We widely accommodate from 1.27mm pitch to 0.25mm narrow pitch products, including irregular special pitches. ●Post-removal handling Electronic components after removal will be delivered after solder removal. We also support delivery in a reel-wound state. Please feel free to consult us about your preferred delivery format. ●Consult us about any type of circuit board! At K-All, we can perform rework on large, high-layer circuit boards, as well as boards with moisture-proof coatings and devices coated with underfill. If you are wondering, "I have a board with the desired components, but can the work really be done..." Before you worry, please consult us first. ●For more details, please contact us or download the catalog.
Price information
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Delivery Time
Model number/Brand name
BGA rework with underfill
Applications/Examples of results
■We can accommodate from just one trial unit. While it is possible to reuse components, we understand that some may feel uneasy about manufacturing using devices removed from other boards. We can start by producing one to a few units for you to evaluate the removed parts, and then consider the next steps. We hope you can first experience our rework technology. Regarding mass production, we have a track record of regenerating up to 100,000 components. Of course, we conduct visual inspections on each individual component before delivery. ■Short lead time response We have rework personnel on-site to provide support. Many companies may perform rework while also conducting assembly work, but we can offer higher quality and shorter lead times for rework. We will also respond quickly to mass production requests. Please feel free to inquire about partial delivery requests. ●For more details, please contact us or download the catalog.
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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.