Registration for the webinar 'Visualization Solutions and Case Studies for Heat-Cured Transfer Molding' is now open.
Kistler Japan G.K. Head office
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low viscosity resins, such as epoxy transfer molding, and low-pressure measurements. We will provide valuable information for customers considering in-mold pressure monitoring, as well as those who are already utilizing it. We hope you will join us! Session 1: May 24, 2023 (Wednesday) 10:35 AM - 11:25 AM Session 2: May 31, 2023 (Wednesday) 10:35 AM - 11:25 AM *Both sessions cover the same content. Please select a convenient date from the related links below and register.
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