Kistler Japan G.K. Head office Official site

Registration is now open for the webinar "Heat-Curable Transfer Molding: Visualization Solutions and Case Studies of the Mold Interior" (5/24)!

Kistler Japan G.K. Head office

In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric in-mold pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and low-pressure measurements. We will provide valuable information for customers considering in-mold pressure monitoring as well as those who are already utilizing it. We invite you to participate! Session 1: May 24, 2023 (Wednesday) 10:35–11:25 Session 2: May 31, 2023 (Wednesday) 10:35–11:25 *Both sessions will cover the same content. You can register for the May 24 session using the form below.