Kistler will hold the "Cutting Processing Technology Seminar 2023"!
Kistler Japan G.K. Head office
We will hold the annual Kistler "Cutting Technology Seminar 2023" in a hybrid format, both in-person and online. We are pleased to welcome Professor Hiroyuki Sasahara from Tokyo University of Agriculture and Technology and Mr. Haruki Kino from MOLDINO Co., Ltd. as our seminar speakers. Additionally, we will exhibit products from MOLDINO Co., Ltd. and our company at the venue. We invite you to visit and see the actual products. For more details, please refer to the following link: https://onl.tw/wskCkvE Date and Time: July 20, 2023 (Thursday) 14:00 - 17:00 (Doors open at 13:00, with product demonstrations) Venue: Safira, 4th Floor, Shin-Yokohama Grace Hotel (Capacity: 40 people) and Online (Webex) Participation Fee: Free (Please register in advance) Details: https://onl.tw/wskCkvE Registration URL: https://forms.gle/G2R1GbesBJfNW3Am7 Registration Deadline: For in-person participation, please register by July 14 (Friday); online participation will be accepted until the day of the event. We encourage you to register through the related links below and participate.
Related Links