Registration for the webinar on 'Visualization Solutions for Error Modes in Power Semiconductor Manufacturing and Post-Processing' is now open.
Kistler Japan G.K. Head office
The registration for this year's first webinar has started! In the post-manufacturing processes of semiconductors, such as dicing, die bonding, and wire bonding, where mechanical stress is applied to the chips, visual inspections and electrical tests after the process are essential. However, these inspection results alone make it difficult to directly understand the error modes during the process. With Kistler's piezoelectric sensors, we can measure the changes in load applied to the product during the process with high precision and dynamically. By understanding the details of error modes from changes during processing, we will introduce hints for process improvement. [Date and Time] 1st Session: January 31, 2024 (Wednesday) 15:05 - 15:50 2nd Session: February 8, 2024 (Thursday) 15:05 - 15:50 Both sessions will cover the same content, so please click on "Register for the Webinar Here" in the "Related Links" below to sign up.
Related Links