The page for the "Visualization Solution for the Inside of Molds in Semiconductor Resin Sealing" has been created!

Kistler Japan G.K. Head office

There is a trend in the automotive semiconductor industry, particularly in power semiconductors, to quantify the internal state of molds, which can be considered a black box, during the resin encapsulation process. This trend is driven by the emergence of issues related to moldability due to the miniaturization and thinning of semiconductor packages and the fine pitch. As a countermeasure, there is an increasing demand for improving productivity and quality through actual measurement of resin filling pressure and temperature within the mold cavity during package molding. In response to this need, Kistler proposes a "visualization solution for the inside of the mold" using high-performance quartz piezoelectric in-mold pressure sensors to measure resin filling pressure and temperature.

Visualizing the internal condition of the mold.

Crystal piezoelectric in-cavity pressure sensor

Date and time
Capital
Entry fee

Related product information

Visualization solution for the interior of molds in semiconductor resin encapsulation.
We propose improvements to the quality and production efficiency of package molding, where issues become apparent!

One of Kissler's core technologies is the adoption of a piezoelectric crystal in-mold pressure sensor, optimized for semiconductor resin encapsulation, with the following features: - Low viscosity resin compatibility ⇒ Structure that prevents measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility for semiconductor resins ⇒ Mold temperature up to 200°C - Durability ⇒ Semi-permanent - Linearity (measurement error) ⇒ Guarantees less than 1% for the measurement range - Resolution ⇒ 1/1000 MPa The "visualization of the inside of the mold" in semiconductor resin encapsulation is a proposed solution to challenges arising from recent demands for miniaturization and thinness in semiconductor packaging. In particular, the rapid expansion of electric vehicles (EVs) has increased the demand for power semiconductors for automobiles, making the improvement of quality in resin-encapsulated packages, as well as enhancements in production efficiency and inspection costs, significant challenges. In addition to traditional software-based flow analysis, measuring and quantifying the in-mold pressure and temperature within the mold cavity using sensors has been recognized as an effective solution, and its adoption has already begun in actual manufacturing lines.