Announcement of a Free Webinar: Visualization Solutions for Error Modes in Power Semiconductor Manufacturing and Backend Processes (6/22)

Kistler Japan G.K. Head office
We will introduce case studies and solutions regarding sensing technologies that focus on the processes of dicing, die bonding, and wire bonding in the growing market of power semiconductors, enabling the optimization of dicing blade maintenance cycles and the detection of defects within the processes. Kistler's quartz piezoelectric sensors are also widely used for process improvements in semiconductor manufacturing processes. We invite those in the semiconductor and semiconductor manufacturing equipment industries to participate. This webinar will be held four times on the following dates, but the content will be the same for all sessions, so please join us on a date that is convenient for you! June 22, 2022 (Wednesday) June 29, 2022 (Wednesday) July 6, 2022 (Wednesday) July 13, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-powersemicon Also, please watch the reference video! "Visualization Solutions for Power Semiconductor Backend Processes" https://youtu.be/tMqvoC2413Q We look forward to many participants joining us.


-
Date and time Wednesday, Jun 22, 2022
10:00 AM ~ 10:45 AM
- Entry fee Free