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Newly released high-power fanless embedded PC "Box Computer® BX-M2510" with a maximum 40% expansion of the usable temperature range thanks to new heat dissipation technology.

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Contec has developed a high-power fanless embedded PC that expands the operating temperature range by up to 40% with a new heat dissipation technology, and began accepting orders for it as "Box Computer® BX-M2510" from January 2023. The new product is an embedded computer compatible with the 9th generation Intel® Core™ desktop processors. The top model is equipped with the Xeon® processor E-2278GEL. With the newly developed heat dissipation technology, the operating temperature range has been expanded from 0-50°C to -10-60°C (+20%) while maintaining the same width and depth dimensions as previous products, and by attaching an optional fan unit, it can be further expanded from 0-50°C to -10-70°C (+40%). There is a growing demand to process high-load tasks such as AI, AR, and image recognition on edge devices, leading to a need for high-spec computers for embedded applications. However, challenges have arisen, such as failures caused by heat when embedded in devices, or costs incurred for special thermal countermeasures to prevent such issues. This product allows for the integration of the necessary computer functions for advanced edge processing into devices without the need for special thermal measures.