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For polishing various substrates and for fine burr removal in punched areas.

【Features】 [Stamper Back Surface Polishing Device] - Various surface roughness requirements from different companies can be met by selecting the appropriate lapping tape and adjusting the device's parameters, allowing for processing under optimal conditions. - The circumferential marks from roll polishing can be randomized using pad polishing. - Once the conditions are set, even beginners can operate it easily. [Thin Plate Flat Polishing Device] - The film width can be selected based on the workpiece (supports two types), achieving high efficiency and low-cost processing. - Effective for polishing various substrates and removing fine burrs from punched areas. - If a sub-table is provided, external setup can be performed during processing time. ● For more details, please contact us or refer to the catalog.

A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!

【Features】 ○ The surface roughness can be freely changed by replacing the tape. ○ The contact roller adheres closely to the workpiece's undulations, allowing for effective polishing. ○ Polishing is performed from the high points of the workpiece, improving flatness. 【Specifications】 [Color Filter Full Polishing Device] ○ Maximum workpiece dimensions: 450×500 mm ○ Maximum workpiece thickness: up to 3 mm ○ Tape width used: 18 inches (457 mm) ○ Table movement speed: variable type with switch control ○ Power supply: 200V, 3-phase ○ Air pressure: 0.4–0.5 MPa ○ Device dimensions: 1300W×1750D×1460H (mm) ○ Device weight: approximately 1500 kg ● For more details, please contact us or refer to the catalog.

Are you having trouble improving the accuracy of surface roughness? Sample tests for film polishing are available!

What is a sample test? When considering the introduction of Sanshin's technology or products/equipment, you can try it out to specifically check processing accuracy, processing time, processing capacity, etc., using your target samples. *For more details, please download the catalog or contact us.

Recognize the shape of the protrusion and correct the position of the polishing center to ensure accurate protrusion correction.

【Features】 [Color Filter Projection Correction Device] ○ Measures the height of the projection and measures the height after tape wrapping. ○ By changing the special polishing pad, the polishing area can be controlled. ○ Pressure can be controlled, preventing damage to the panel. 【Specifications】 ○ Usable panel dimensions → Maximum: 450mm × 450mm → Minimum: 300mm × 300mm ○ Panel thickness: 1.1mm ○ Wrapping tape width: 1/4 inch (6.3mm) 100m or 200m roll ○ Tape unit vertical movement: 50 to 0.001mm ○ Power supply: 200V, 3-phase ○ Air: 0.4 to 0.5MPa ○ Device dimensions: 1200W × 1400D × 1680H (mm) ○ Weight: Approximately 500kg ● For more details, please contact us or refer to the catalog.

Maximizing the features of the wrapping tape makes the intended polishing easy.

**Features** [PCB Surface Polishing Device] ○ Easy management of roughness by selecting tape grit ○ Usable for both wet and dry applications ○ Once set up, anyone can use it easily **Specifications** ○ Workpiece dimensions that can be processed: Maximum 510mm × 510mm ○ Tape specifications → Tape width = 60mm → Maximum roll length = 100m → Core = 3 inches ○ Table speed: Maximum speed = 80mm/second ○ Control → Equipment = Sequencer → Control panel = Touch panel ○ Power supply: 200V, 3-phase ○ Air: Dry air = 0.4–0.5MPa ○ Device dimensions: 2400W × 1400D × 1900H (mm) ○ Device weight: Approximately 3000kg ● For more details, please contact us or refer to the catalog.