New Reflow "VFR Series"
High-efficiency insulation structure (inner jacket)! Prevents chip standing by balancing far infrared rays and warm air!
We would like to introduce our new reflow model, the "VFR Series." With a special far-infrared panel heater and hot air circulation method, it enables temperature profile settings comparable to hot air reflow. Additionally, it improves wettability and suppresses voids, preventing chip standing, flying, and misalignment through hot air balance. 【Features】 ■ Special far-infrared panel heater and hot air circulation method ■ Dual configuration of single lane ■ High-efficiency insulation structure reduces heat loss (furnace surface temperature below approximately 40°C) ■ Low nitrogen consumption (below 1000ppm at 250NL/min) ■ Water-cooled radiator cooling mechanism *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications (Partial)】 ■External dimensions: 6510 (L) × 1060 (W) × 1440 (H) ■Pass line: 900 ± 20mm ■Conveying speed: 0.2 to 1.6m/min ■Supported substrate dimensions: 50mm to 400mm (W) × 100mm to 400mm (L) ■Component height: 20mm above the substrate / 20mm below *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
