Soldering device
Soldering device
We would like to introduce the "soldering equipment" that we handle.
1～20 item / All 20 items
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Selective soldering device 'SELBO-III'
Equipped with a variety of features! Flexible addition and reduction of modules is possible.
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Program Creation System "Freedom"
For selective soldering equipment! Detecting ground connection pins that require preheating time.
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Point jet soldering device 'EQS-350'
Simplification of NC software creation! Improved productivity through the expansion of the "solder bath module."
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Point jet soldering device 'EQSS-350SD'
Production management (traceability) supports quality control! Introducing our soldering equipment.
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Lead-free compatible nitrogen soldering device 'GFL-350N'
The dome cover is removable! It reduces solder droplet generation and suppresses solder hole formation with its jet mechanism.
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Lead-free compatible long lead component soldering device 'LMFS-400'
Cost reduction of dedicated nozzles! The cast solder pot prevents corrosion from lead-free solder.
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Overflow-type automatic soldering device "SOFR-400"
Improving productivity of pallet dips! Enhancing through-hole ups of "low Ag solder."
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Announcement of the opening of MUSUBI Satellite Lab WEST (joint venture of 7 companies)
Not just a showroom, but launching an "experimental lab"! Seven manufacturers are exhibiting.
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Notice of Participation in the 38th Internepcon Japan
Exhibiting new equipment at Tokyo Big Sight! A reflow oven that significantly extends the frequency of in-furnace cleaning and a selective soldering machine with new features, among others.
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Maintenance Contract Pack <ULTIMA Series>
Achieve quality maintenance at a great value in optimal conditions! Using high-quality genuine parts.
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New feature "IPH" added to Selective Flow (such as Tacrolimus).
Solve the long-awaited issue of insufficient through-hole ups! Effectively heat the necessary areas for soldering.
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Tabletop Selective Device "ULTIMA Series"
Space-saving, cost-effective replacement of hand soldering processes and improvement in quality is possible.
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Far Infrared Combined Hot Air Circulation Reflow Oven "VFR Series"
Decomposing flux with a special far-infrared panel heater to prevent sticking inside the furnace!
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Selective soldering equipment "SELBO III series"
Achieve labor-saving and automation with inline systems! Layout changes are possible with a modular configuration.
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Notice of Participation in "Nepcon Japan Electronics Development and Implementation Exhibition"
We plan to exhibit a total of six devices, including selective soldering equipment and a doctor palette!
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Koki Tech Co., Ltd. General Catalog
The pursuit of customer satisfaction leads to new technological innovations! Hiroki Tech products are born from a accumulation of cutting-edge technology.
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Soldering device "ULTIMA-NEO-L Smart"
Area productivity increased by 15%! Maintaining substrate compatibility with a maximum size of 380×460 allows for diverse production.
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Desktop Selective Soldering Series
The substrate size is X50×Y50mm (MIN), X330×Y250mm (MAX)! Introducing our soldering series.
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Notice of Participation in "JISSO PROTEC 2025"
Held from June 4 (Wednesday) to June 6 (Friday), 2025! We plan to showcase new products at the exhibition venue.
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KOKI TEC ASIA Exhibition Hall
We provide equipment configurations tailored to our customers' needs based on unique ideas!
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