Overflow-type automatic soldering device "SOFR-400"
Improving productivity of pallet dips! Enhancing through-hole ups of "low Ag solder."
The "SOFR-400" is an overflow-type automatic soldering machine that allows for the selection of four DIP methods. The production method can be chosen between inline compatibility and cell production compatibility (return back). In the peel-back DIP method, four electric cylinders are used, allowing for peel-back at angles of up to 4 degrees. 【Features】 ■ Four DIP methods can be selected ■ N2 supply is conducted simultaneously from four locations: the substrate transport section and the side of the solder tank, creating an N2 curtain that covers the solder surface ■ The production method can be chosen between inline compatibility and cell production compatibility (return back) ■ Compact design achieves space-saving *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Specifications (Partial)】 ■ Solder capacity: Approximately 490kg (when solder specific gravity is 7.3) ■ Cooling fans: Installed above and below the preheating section (12 units) ■ Work size: MAX 460×400mm ■ Lead wire length: 40mm or less ■ External dimensions: 2695L×1150W×1340Hmm * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
