Lead-free compatible long lead component soldering device 'LMFS-400'
Cost reduction of dedicated nozzles! The cast solder pot prevents corrosion from lead-free solder.
The "LMFS-400" is a soldering device that can handle processes from partial dip to full dip using a 4-axis peel-back mechanism. By adopting a high-performance (low pressure, fine particle) spray nozzle, it achieves a coating efficiency of over 70% and good through-hole fill. After soldering, cooling fans are placed in two locations: the descending lifter section and the bottom return conveyor section. 【Features】 ■ Spray Fracture ■ Preheating ■ Soldering ■ Cooling ■ Monitor *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications (Partial)】 ■ Minimum board size: 50W × 50L mm ■ Maximum board size: 400W × 450L mm ■ Board thickness: 1.0 to 2.0 mm ■ Component height: 100 mm or less from the top surface of the board ■ Lead wire length: 40 mm or less from the bottom surface of the board *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
