Selective soldering equipment "SELBO III series"
Achieve labor-saving and automation with inline systems! Layout changes are possible with a modular configuration.
The "SELBOIII Series" is an inline selective soldering device that can add modules according to production volume. It improves soldering quality and reduces solder defects. Additionally, the optional substrate warpage correction function prevents nozzle contact. It also features various functions such as an air jet nozzle and a selective soldering bath. 【Features】 ■Improves soldering quality and reduces solder defects ■Supports labor-saving and automation in an inline format ■Can add modules according to production volume ■Layout changes possible with modular configuration ■Non-stop maintenance system (optional) *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Features】 ■Nozzle contact prevention with substrate warpage correction function (optional) ■Supports MES, automatic setup, and traceability (optional) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."