N2 Reflow Device VFR-4010N
Achieve easy maintenance with a special filter! You can switch between hot air, warm air, and warm air + far infrared!
The "N2 Reflow Device VFR-4010N" is a unit that combines a unique heating method using a special far-infrared panel heater along with hot air circulation. Depending on the substrate (thickness) and mounted components, it is possible to utilize not only hot air circulation but also the advantages of far-infrared effects for production. This device is designed with consideration for substrates and components. 【Features】 ■ Hot air circulation reflow oven with far-infrared combination ■ Adoption of special far-infrared panel heater ■ Minimizes flux accumulation in the oven, extending maintenance intervals ■ Special filter for mist recovery in the oven (can be reused after cleaning) ■ Energy-saving through reduced heat loss with high-efficiency insulation structure *For more details, please refer to the PDF materials or feel free to contact us.
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【Specifications (Partial)】 ■External dimensions: 6510(L) × 1060(W) × 1440(H) mm ■Pass line: 900 ± 20 mm ■Transport speed: 0.2 to 1.6 m/min ■Compatible board dimensions: 50 × 100 to 400 × 400 (W × L) mm ■Component restrictions: 30 mm above the board / 20 mm below the board *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."