Helium Leak Tester (Atmospheric Pressure Chamber Method) HE-AT350
The leak testers developed by Wano Industry have received high praise from customers in various industries.
Are you having trouble with leak testing? ▶ I want to introduce a helium leak tester at a low cost as much as possible. ▶ I want a small-sized tester instead of large equipment, and I want to shorten the inspection time. ▶ I want to introduce custom-made equipment because off-the-shelf products do not meet our internal standards. Wano Kogyo's helium leak testers: ▶ Achieve low prices! ▶ Reduce equipment size and shorten cycle time. ▶ Custom-made equipment production. *For more details, please refer to the PDF materials or feel free to contact us.
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Recommended products
Distributors
In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."