External Fracsa-type wave soldering device 'FLOX-350'
The soldering pot adopts an external heating method! The pot is made of cast iron with anti-rust treatment on the inner surface.
The "FLOX-350" is an external flux wave soldering device equipped with a high-efficiency motor and an excellent preheating system. It features a direct drive plate mount structure, specially manufactured stainless steel chain drive, and uniquely designed aluminum alloy guide rails, making it robust and highly durable. Additionally, the transport system employs a segmented floating structure that effectively prevents deformation of the guide rails, ensuring stable operation over the long term. 【Features】 ■ External flux type for high safety and easy maintenance ■ Excellent preheating system with a high-efficiency motor ■ Stable transport with a special transport design ■ Foreign object drop prevention with a high-efficiency exhaust hood *For more details, please download the PDF or feel free to contact us.
basic information
【Specifications (Partial)】 ■Spray Method: Inclined Spray Type ■Control Method: PC + PLC ■Applicable Board Size (Width): 50–350mm ■Device Dimensions: L5050×W1420×H1750mm ■Device Weight: Approximately 1850kg *For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（1）
Download All Catalogs
Recommended products
Distributors
In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."