[Use Cases for Semiconductors] Carbon Fiber/Carbon Fiber Composite Material 'CFRP'

Reduction of takt time is possible! Lightweighting through CFRP application, reduction of deflection, and improvement of vibration damping.

We will introduce examples of the use of carbon fiber/carbon fiber reinforced plastics (CFRP) for semiconductors. Mitsubishi Chemical provides a variety of carbon fibers by utilizing both PAN-based and pitch-based raw materials. The characteristic properties of carbon fiber are that it is lightweight, has high strength, and high elasticity. As carbon fiber composite materials combined with resin, they are widely used in aerospace, sports and leisure, and industrial applications. 【Product Example】 ■ Application: Semiconductor manufacturing equipment ■ Adopted part: Pick ■ Required characteristics: Lightweight/high rigidity/vibration damping/heat resistance ■ Size: Total length 400mm/total width 150mm/total height 2mm ■ Weight: 80g *For more details, please refer to the PDF document or feel free to contact us.

basic information

【Features of CFRP】 ■ Lightweight: Material density is 1/4 that of steel and 2/3 that of aluminum ■ High rigidity: Elastic modulus can be designed to exceed that of steel ■ Small diameter and thin-walled design (compact design) ■ High vibration damping ■ High thermal conductivity ■ Low thermal expansion *For more details, please refer to the PDF document or feel free to contact us.