Introduction of pitch-based CFRP applications in semiconductor manufacturing equipment.

Contributing to the performance enhancement of semiconductor manufacturing equipment! CFRP enables lightweight design, improved vibration damping, and enhanced thermal dimensional stability!

"Pitch-based carbon fibers" not only have lightweight and high rigidity but also possess the characteristics of low thermal expansion rate and high thermal conductivity. By utilizing the features of anisotropic materials, it is possible to impart physical properties (such as elastic modulus and thermal conductivity) in a targeted direction, as well as to design for zero thermal expansion in both the X and Y directions. As a manufacturer of pitch-based carbon fibers, we can propose appropriate CFRP designs that leverage the characteristics of the material. [Features] - Weight reduction of 40-60% possible (compared to aluminum and ceramics) - Quick vibration damping allows for reduced takt time - Thermal expansion rate can be made nearly zero - Can be used for parts where dimensional changes due to heat need to be minimized - High thermal conductivity prevents ignition due to heat dissipation - Can be used for heat dissipation applications *For more details, please refer to the PDF document or feel free to contact us.