Introduction of Pitch Type CFRP "Semiconductor Wafer Transport Hand"
The pitch-type CFRP "semiconductor wafer transport hand" is lightweight, has low deflection, quick vibration damping, and high conductivity!
"Pitch-based CFRP" features lightweight and high rigidity, enabling the reduction of weight in wafer transport hands and minimizing load deflection. Additionally, wafer transport hands made from pitch-based CFRP exhibit rapid vibration damping, contributing to shorter equipment cycle times. **Benefits of Using CFRP in Wafer Transport Hands** - High specific modulus (modulus of elasticity ÷ weight) allows for lightweight, thin designs and reduced deflection. - Excellent vibration damping properties enable high-speed operation and reduced cycle times. - Enhanced conductivity allows for static electricity prevention. **Common Needs** - Due to limited space within the equipment, there is a desire to reduce the thickness of the hands and minimize deflection. - As the weight of the workpieces increases, there is a need to adopt materials with high Young's modulus. - Lightweight hands are necessary for high-speed operation. - There is a need to quickly suppress vibrations in the hands to shorten cycle times. **What Mitsubishi Chemical Can Offer** We can manufacture and sell carbon fibers and prepregs, as well as design products using these materials. Furthermore, we can provide comprehensive support from molding, processing, assembly, coating, to inspection. *For more details, please refer to the PDF materials or feel free to contact us.*
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【Application】 ■ Semiconductor wafer transport application * For more details, please refer to the PDF document or feel free to contact us.
