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"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

●What is Hot Melt Molding? It is a technology that demonstrates excellent sealing performance by directly injecting hot melt adhesive into electronic components. □Advantages of Adoption 1. Reduction in Processing Time Hot melt molding completes one molding cycle in about 10 seconds to several tens of seconds. Unlike potting, there is no need for curing time. 2. Reduction in the Number of Parts Unlike potting, hot melt molding does not require a case. This allows for a reduction in the number of parts and production processes. 3. Reduction in the Amount of Resin Used Hot melt molding can be shaped with minimal thickness that conforms to the inserted components. At Matsumoto Processing, we respond quickly to the reliability requirements of our customers' products by proposing optimal hot melts, modeling sealing shapes, designing and manufacturing molds, and prototyping. For customers wishing to introduce hot melt molding processes in-house, we provide comprehensive support including the manufacturing and sale of molding machines and molds, development of molding parameters, process startup assistance, and supply of hot melt adhesives. Additionally, for customers who wish to outsource hot melt sealing, we offer contract molding services.

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

What is hot melt molding? Advantages of hot melt molding How to get started with hot melt molding? We will answer such questions. ■Please download the catalog from below. Matsumoto Processing will respond quickly to your needs by proposing the optimal hot melt solution, modeling sealing shapes, designing and manufacturing molds, and creating prototypes based on your product reliability requirements. For customers wishing to implement hot melt sealing processes in-house, we provide comprehensive support including the manufacturing and sales of molding machines and molds, development of molding parameters, process startup assistance, and hot melt supply. For customers who wish to outsource hot melt sealing, we offer contract molding services at our factory.

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

Hot melt molding is gaining popularity in automotive electrical components due to its excellent productivity and ability to contribute to miniaturization and lightweight design. Matsumoto Processing, after understanding the reliability requirements of our customers' products, provides optimal hot melt proposals, sealing shape modeling, analysis, mold manufacturing, and prototyping in a short period. For customers wishing to introduce hot melt sealing processes in-house, we offer comprehensive support including the manufacturing and sale of molding machines and molds, development of molding parameters, process startup assistance, and supply of hot melt materials. For customers who wish to outsource the hot melt sealing process, we provide contract molding services at our own factory.

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.

Our company provides comprehensive technical support under the customer-first philosophy, from product shape design, prototype mold design and manufacturing, prototype evaluation, process proposals during mass production, to molding equipment design and manufacturing, and mass production startup support. Our in-house technical sales staff utilize their extensive experience, which spans hundreds of cases, along with technologies such as 3D-CAD design, custom-developed flow analysis, and residual stress analysis to make optimal proposals.