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Adhesion between polyimide film and copper foil is possible using NMP completely free water-based polyimide varnish! Adhesion strength data and processing conditions are included!

MP Five Cooperation Food & Chemical has established a unique technology development department at the Suita Research Center. In the technology development department, we have been developing electronic material products from tannic acid and pyrogallol for many years. Based on our achievements, we received requests from users to develop "easy-to-handle polyimide products," and we would like to introduce our developed "NMP-free water-based polyimide varnish." *For more details, please refer to the PDF materials or feel free to contact us.

Completely NMP-free! A water-based polyimide varnish with excellent handling properties, high heat resistance, and chemical resistance, featuring low viscosity. Documentation is available, and free samples are being provided!

【Features】 Conventional polyamic acid-based polyimide varnishes have very high viscosity, making them difficult to handle and requiring refrigeration due to low storage stability. In contrast, this developed product addresses these drawbacks, offering excellent handling properties with storage stability at room temperature and reduced viscosity comparable to general functional coatings. ■ Environmentally friendly water-based polyimide varnish ■ High heat resistance and chemical resistance ■ Can be stored at room temperature ■ Viscosity suitable for coating ■ Mixing proposals with other resins are possible ■ Improvement of working environment and global environmental enhancement *For more details, please refer to the PDF document or feel free to contact us.