[MST Homepage] Analysis Case "Investigation of Curing Temperature and Glass Transition Temperature of Epoxy Resin" has been published.
一般財団法人材料科学技術振興財団 MST
We have published analysis cases on the MST homepage. ◆Title Investigation of Curing Temperature and Glass Transition Temperature of Epoxy Resin ~Thermal Property Evaluation by DSC (Differential Scanning Calorimetry) Measurement~ ◆Measurement Method / Processing Method DSC ◆Product Field Electronic Components / Daily Necessities ◆Analysis Purpose Product Investigation / Thermal Property Evaluation ◆Overview Using DSC (Differential Scanning Calorimetry), we investigated the curing temperature and the glass transition temperature (Tg), which is an indicator of heat resistance, for a two-component epoxy resin. The DSC measurement of the uncured resin confirmed that a rapid exothermic reaction began around 103°C (Figure 1). This was due to the polymerization (curing) of the resin caused by the temperature increase. Furthermore, after air cooling the cured resin to room temperature, a second DSC measurement showed a shift of the baseline towards the endothermic side due to the glass transition of the resin, with Tg being approximately 116°C (Figure 2). ★★For detailed data, please see the linked page★★
