Differential Thermal Balance - Mass Spectrometry Method

Measurement of weight change, differential thermal analysis, heat quantity, and mass of volatile components resulting from heating the sample.

TG-DTA simultaneously evaluates weight changes due to heating (TG) and thermal behavior of endothermic and exothermic reactions (DTA). Additionally, TG-DTA-MS continuously assesses volatile components (MS) along with TG and DTA evaluations. - TG allows for the detection of weight changes on the order of percentage. - DTA provides insights into reactions such as pyrolysis, melting, sublimation, oxidation, combustion, and phase transitions. - MS enables the structural estimation of volatile components and decomposition products.

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■TG: Thermogravimetry The change in weight caused by heating is detected by the tilt of a balance. The balance is continuously adjusted to remain level. In this way, the continuous recording of the weight difference with a reference substance is achieved. The conditions of oxidation-reduction, thermal decomposition, adsorption-desorption, evaporation, and volatility can be measured from the increase or decrease in weight and the thermal changes indicated by DTA. ■DTA: Differential Thermal Analysis The reference substance and the sample are heated simultaneously, and the temperature difference between the two is measured by a thermocouple and recorded continuously. From the changes in temperature difference, the presence of thermal changes and the type of reactions can be determined.

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[TG-DTA] Organic substances, resins, adhesives, glues, biomacromolecules, etc.: Evaluation of melting point, thermal decomposition temperature, and combustion temperature is possible. Metals: Evaluation of melting point is possible. Rubber, battery materials, etc.: Estimation of the ratio of organic and inorganic substances is possible. [TG-DTA-MS] Organic substances, resins, adhesives, glues, biomacromolecules, etc.: Component analysis during thermal decomposition and combustion is possible.

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News about this product（1）

[MST Homepage] Analysis Case "Investigation of Curing Temperature and Glass Transition Temperature of Epoxy Resin" has been published.
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We have published analysis cases on the MST homepage. ◆Title Investigation of Curing Temperature and Glass Transition Temperature of Epoxy Resin ~Thermal Property Evaluation by DSC (Differential Scanning Calorimetry) Measurement~ ◆Measurement Method / Processing Method DSC ◆Product Field Electronic Components / Daily Necessities ◆Analysis Purpose Product Investigation / Thermal Property Evaluation ◆Overview Using DSC (Differential Scanning Calorimetry), we investigated the curing temperature and the glass transition temperature (Tg), which is an indicator of heat resistance, for a two-component epoxy resin. The DSC measurement of the uncured resin confirmed that a rapid exothermic reaction began around 103°C (Figure 1). This was due to the polymerization (curing) of the resin caused by the temperature increase. Furthermore, after air cooling the cured resin to room temperature, a second DSC measurement showed a shift of the baseline towards the endothermic side due to the glass transition of the resin, with Tg being approximately 116°C (Figure 2). ★★For detailed data, please see the linked page★★

Oct 20, 2011

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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!

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