[Analysis Case] Electronic Components
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[Analysis Case] Electronic Components
We will introduce examples of electronic component analysis.
1~30 item / All 117 items
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[Analysis Case] Evaluation of Depth Distribution of Alkali Metals in SiO2 Using SIMS
High-precision distribution evaluation of alkali metals through sample cooling.
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[Analysis Case] Wide-Area Cross-Section Observation of Bumps
Wide-area observation of micro-specific locations is possible through cross-section preparation using ion polishing.
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[Analysis Case] Evaluation of Ultra-Shallow Implant Profiles by SIMS
Evaluation of dopant distribution and junctions is possible even in extremely shallow regions.
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[Analysis Case] Investigation of Contamination Causes on Silicon Wafers
Evaluation of contamination originating from gloves
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[Analysis Case] Evaluation of the Surface Silanol Groups
Quantitative evaluation of silanol groups is possible with TOF-SIMS.
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[Analysis Case] Analysis of H termination on Si surface
Qualitative and relative comparison of SiH and states on the Si surface due to differences in processing.
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[Analysis Case] Composition and Thickness Evaluation of Ultra-Thin SiON Films
Estimation of film thickness using the average free path of photoelectrons.
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FIB low acceleration processing
FIB: Focused Ion Beam Processing
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Pre-treatment and measurement under high purity atmosphere.
XPS: X-ray photoelectron spectroscopy, etc.
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[Analysis Case] Evaluation of "Water" in Si Oxide Films and ITO Films using SIMS
Depth-direction analysis of hydrogen using 'heavy water (D2O) treatment'
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[Analysis Case] Qualitative Analysis of Epoxy Resin
Estimation of components is possible through TOF-SIMS analysis.
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Distortion evaluation using SEM equipment
EBSD: Electron Backscatter Diffraction
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[Analysis Case] Identification of Fluorine-based Lubricants and Polymers using TOF-SIMS
Identify the contaminating components and estimate the contamination occurrence process.
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[Analysis Case] Preprocessing Technology for Specific Areas of Wafers and Chips
We will sample only the target area and produce samples without breaking the wafer.
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[Analysis Case] Investigation of Curing Temperature and Glass Transition Temperature of Epoxy Resin
Evaluation of thermal properties by DSC (Differential Scanning Calorimetry) measurement.
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[Analysis Case] Depth Direction Analysis of Polyimide Components
Evaluation of the depth direction of surface modification layers of polymers, resins, and films using TOF-SIMS is possible.
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[Analysis Case] Investigation of the Causes of Wettability Changes Due to Plasma Treatment
Evaluation of the top surface of modified layers of polymers, resins, and films using TOF-SIMS is possible.
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[Analysis Case] Evaluation of Crystal Structure by Micro XRD Analysis
XRD measurements in micro areas are possible.
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[Analysis Case] Evaluation of Impurities in Metal Wires
Visualizing the in-plane distribution of impurities such as atmospheric components with a field equivalent to SEM.
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[Analysis Case] SIMS Measurement of Specially Shaped Samples
Analysis is possible even for special shapes through innovative fixing methods.
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[Analysis Case] Evaluation of the Cleaning Effect of Organic Ingredients
You can measure the 300mm wafer as it is.
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Analysis case: Evaluation of the in-plane distribution of additives in solder alloys.
Capable of highly sensitive evaluation of the distribution of additives at the ppm level.
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Analysis of crystal grains below 30nm using the EBSD method.
EBSD: Electron Backscatter Diffraction
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Interference peak removal process in quantitative analysis
X-ray photoelectron spectroscopy (XPS)
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[Analysis Case] Structural Evaluation of Magnetic Head MTJ Section
High-resolution TEM observation using Cs-corrected TEM
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[Analysis Case] Quantification of Hydroxyl Groups by Chemical Modification XPS
Evaluation of Hydroxyl Groups in Polymer Films
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[Analysis Case] Evaluation of Distribution State and Component Analysis of Fluorine-based Films
Evaluation of distribution uniformity and identification/estimation of organic matter through surface analysis of microdomains.
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[Analysis Case] Evaluation of the Degradation Layer of Polycarbonate
It is possible to evaluate the film thickness of the degraded layer using the GCIB (Ar cluster).
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[Analysis Case] Analysis of Smartphone Sealants by Pyrolysis GC/MS
Analysis of UV-curable materials is possible through two-stage heating.
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[Analysis Case] Foreign Substance Analysis Using Micro-Sampling Tools
Identifies the components of foreign substances without the influence of the substrate or base material.
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