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[Analysis Case] Wide-Area Cross-Section Observation of Bumps

C0089.jpg

[Analysis Case] Wide-Area Cross-Section Observation of Bumps

C0089.jpg
C0089.jpg

Wide-area observation of micro-specific locations is possible through cross-section preparation using ion polishing.

The Ion Polish (IP) method allows for the production of cross-sections with minimal processing damage (such as delamination at interfaces, step differences due to hardness variations, and scratches from polishing) that were problematic in mechanical polishing methods. The positional accuracy of processing is also improved, enabling the creation of wide-area cross-sections that include small features. Due to the minimal damage to the crystals, clean crystal patterns can be obtained. Additionally, since there is no influence from mechanical stress, detailed evaluation of the cross-sectional structure of specific areas can be conducted through AES analysis, SEM observation, and EDX analysis while faithfully preserving the internal structure.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/17…

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Analysis of electronic components.

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[Analysis Case] Wide-Area Cross-Section Observation of Bump_C0089

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