[EMS] Emission Microscopy Method

Rapid identification of the malfunctioning area.

last updated Mar 12, 2025

[OBIRCH] Light Beam Heating Resistance Variation Method

OBIRCH is a method that utilizes the change in resistance caused by the heat generated at defect locations when light is applied, to identify abnormal areas.

last updated Mar 12, 2025

Lock-in thermal analysis method

The lock-in thermal analysis method detects slight temperature increases in the current path.

last updated Mar 12, 2025

[C-SAM] Ultrasonic Microscopy Method

C-SAM is a non-destructive method for observing defects such as delamination within a sample.

last updated Mar 12, 2025

[SXES] Soft X-ray Emission Spectroscopy

SXES is a method that evaluates the chemical bonding state using soft X-rays emitted from materials.

last updated Mar 12, 2025

X-ray CT method

X-ray Computed Tomography

last updated Mar 12, 2025

Case studies related to EV (Electric Vehicle) analysis

Analyze the EVolution of EV development!

last updated Jun 06, 2024

Thermal shock test

We evaluate the durability of electronic components and devices when repeatedly exposed to high and low temperatures.

last updated Mar 12, 2025

Joint strength test

We evaluate the bonding strength of products and parts.

last updated Mar 12, 2025

Vibration test

We evaluate the effects of vibrations and durability on electronic components, electronic devices, and other products during use or transportation.

last updated Mar 12, 2025

Impact test

We evaluate the impact of shocks and durability that electronic components, electronic devices, and other products experience during use or when dropped.

last updated Mar 12, 2025

Constant temperature and humidity test

It is possible to evaluate the resistance when a certain load (temperature, humidity, pressure, voltage) is applied to materials and components.

last updated Mar 12, 2025

Air tightness test

We evaluate and determine the sealing performance of sealed states in hollow structure components and the like.

last updated Mar 12, 2025

Solder Wetting Test

Testing can be conducted using the solder pot balance method, solder ball balance method, and solder paste method.

last updated Mar 12, 2025

Solder heat resistance test

We will evaluate the impact of thermal stress on electronic components in the implementation process.

last updated Mar 12, 2025

TCC (Rapid Temperature Change) Test

Temperature cycle testing is possible with sample temperature control and air temperature control.

last updated Mar 12, 2025

PIND test

By detecting the sound generated when tiny foreign objects inside the hollow structure collide with the wall, it is possible to prevent troubles such as shorts before they occur.

last updated Mar 12, 2025

ESD test

We evaluate the effects and destruction tolerance when semiconductors and electronic components are subjected to stress from static electricity.

last updated Mar 12, 2025

[Analysis Case] Evaluation of Metal Impurities in the Metal Film and Interface of the Device

Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.

last updated Jul 18, 2025

Observation of structural changes in metallic materials through tensile testing using in situ X-ray CT.

Capable of evaluating three-dimensional structural changes according to tensile stress.

last updated Jul 24, 2025