一般財団法人材料科学技術振興財団 MST Official site

Thermal shock test

We evaluate the durability of electronic components and devices when repeatedly exposed to high and low temperatures.

It is also possible to apply voltage to the sample, measure the temperature profile in the chamber, and conduct sampling evaluations during the specified cycle.

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basic information

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Applications/Examples of results

- Temperature resistance evaluation of electronic components and devices exposed to rapid temperature changes - Temperature resistance evaluation of automotive components - Evaluation of crack occurrence between materials due to differences in thermal expansion rates - Evaluation of the aging changes in joint strength and joint interface in solder mounting

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