[Analysis Case] Power Device
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[Analysis Case] Power Device
We will introduce examples of power device analysis.
1~30 item / All 89 items
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[Analysis Case] Contamination Assessment of Si Wafer Bevel Area
It is possible to evaluate both metal components and organic components simultaneously.
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[Analysis Case] Evaluation of the Diffusion Layer of Power Transistors (DMOSFET)
You can understand the positional relationship between the gate layer, source layer, and body layer.
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[Analysis Case] Investigation of Defective Bipolar Transistors (IGBT)
Identification of failure locations using an emission microscope with a high voltage power supply.
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[Analysis Case] Breakdown Observation of 600V Rated SiC Diode
Consistent analysis from preprocessing to luminescence location identification.
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[Analysis Case] SCM Analysis of SiC Planer Power MOS
You can visualize the diffusion layer structure of SiC devices.
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[Analysis Case] Depth Profile Analysis of Dopant Elements in SiC Using SIMS
It is possible to evaluate the depth distribution of B, Al, N, P, and As in SiC with high sensitivity.
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[Analysis Case] Evaluation of SiC Power MOSFET Dopants by SIMS
Imaging SIMS enables the evaluation of localized elements.
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[Analysis Case] SiC by SIMS
Imaging SIMS allows for the evaluation of localized elements.
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[Analysis Case] Photoluminescence Mapping Measurement of SiC Diodes
Detection cases of stacking faults in SiC.
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[Analysis Case] Dopant Investigation in NPT-IGBT Using SIMS
Evaluation of localized elements is possible with imaging SIMS.
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[Analysis Case] Evaluation of Gate Oxide Film on SiC Substrate
Evaluate film thickness, density, and bonding state.
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[Analysis Case] SSDP-SIMS Analysis on SiC Substrates
It is possible to obtain the dopant concentration profile from the SiC substrate side.
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[Analysis Case] Depth Profile Analysis of Dopant Elements in SiC Using SIMS 2
Measurements will be taken according to the analysis conditions suited to the purpose.
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[Analysis Case] Composite Evaluation of the Active Layer of SiC Power MOSFETs
Evaluate the shape of the active layer and the dopant.
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[Analysis Case] Evaluation of Contact Electrodes for SiC Power MOSFETs
Identification of the interface between contact electrodes and SiC layer, and evaluation of elemental distribution.
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[Analysis Case] Lock-in Thermal Analysis of Package Products
Non-destructive analysis of leakage points in Si-based power diodes.
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[Analysis Case] Evaluation Case of Hydrogen Injection Sample using SRA/SIMS
Introduction to Case Studies on Carrier Concentration Analysis in Lifetime Control Samples
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[Analysis Case] Evaluation of Bonding State and Film Thickness of SiC Surface
In addition to detailed condition assessment, film thickness calculation is possible.
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[Analysis Case] Preprocessing Technology for Specific Areas of Wafers and Chips
We will sample only the target area and produce samples without breaking the wafer.
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[Analysis Case] Ultra-high Sensitivity Measurement of Impurities in Silicon Using SIMS
We will enhance the sensitivity and evaluate the concentration distribution at the ppt level.
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[Analysis Case] SIMS Analysis of Compound Layered Structure Samples
Analysis is possible after selectively removing the compound layer through preprocessing.
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[Analysis Case] Composition Analysis of GaN-based LED Structures using SIMS
Capable of evaluating the composition of the main elemental components of GaN-based LEDs in the depth direction.
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[Analysis Case] Composition and Thickness Evaluation of Ultra-Thin SiON Films
Estimation of film thickness using the average free path of photoelectrons.
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[Analysis Case] Evaluation of Ultra-Shallow Implant Profiles by SIMS
Evaluation of dopant distribution and junctions is possible even in extremely shallow regions.
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[Analysis Case] Evaluation of Film-Forming Component Encroachment on the Back Surface of the Wafer
Quantitative evaluation of metal components is possible near the bevel area.
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[Analysis Case] Evaluation of Si Natural Oxidation Film Thickness
Estimation of film thickness using the average free path of photoelectrons.
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[Analysis Case] SIMS Measurement of Specially Shaped Samples
Analysis is possible even for special shapes through innovative fixing methods.
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[Analysis Case] Diffusion Evaluation of Ga and Al in Si Substrate using SSDP-SIMS
Measurement avoiding the influence of high concentration layers using SSDP-SIMS.
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[Analysis Case] Evaluation of Element Distribution in Textured GaN-based LEDs
Even with a structure that has uneven surfaces, depth distribution evaluation is possible through flattening processing.
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[Analysis Case] Depth Profile Concentration Analysis of Impurities in GaN-based LEDs Using SIMS
Measurements will be taken under analysis conditions suited to the purpose.
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